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Modified Polyamide Glue PA Low Temperature Hot Glue Adhesive For Shoes
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Modified Polyamide Glue PA Low Temperature Hot Glue Adhesive For Shoes
| Place of Origin | China |
| Brand Name | JCC |
| Certification | Oeko-tex Certificate, ISO, ZDHC |
| Model Number | JCC-PA 2080， JCC-PA 2170 |
| Document | Polyamide Products(Modified...A).pdf |
Product Details
Material:
Polyamide
Color:
Light Yellow
Melting Temperature:
80-90 ℃
Classification:
Hot Melt Adhesives
Main Raw Material:
Polyamide, PA
Other Names:
Hot Melt Glue
Application:
Shoes Lining
Packing:
20g/bag
Highlight:
polyamide hot melt adhesive for shoes
,low temperature polyamide glue
,modified PA adhesive for footwear
Payment & Shipping Terms
Minimum Order Quantity
1000KG
Price
USD 3.00 - 9.00 /KG
Packaging Details
bags
Delivery Time
8-10 days
Payment Terms
T/T
Supply Ability
2000 tons/month
Product Description
Modified Polyamide Glue PA Low Temperature Hot Glue Adhesive For Shoes
Modified Polyamide Glue PA Low Temperature Hot Glue Adhesive is specially formulated for leather shoes lining applications, offering strong adhesion without damaging heat-sensitive materials.
Product Specifications
| Material | Polyamide |
|---|---|
| Color | Light yellow |
| Type | Granule and powder |
| Melting Temperature | 80-90 ℃ |
| Peel Strength | High |
| Open Time | 10-20 seconds |
Product Overview
Modified Polyamide Glue is a thermoplastic hot melt adhesive based on modified polyamide resin, specially formulated to melt and bond at relatively low temperatures. Its low melting temperature and excellent oil resistance make it ideal for bonding leather and lining materials in shoe manufacturing, offering strong adhesion without damaging heat-sensitive substrates.
Technical Specifications
| Series | Type | Form | Melting Range | Melting Flow Index @160℃, 2.16kg |
|---|---|---|---|---|
| PA Material | JCC-2080 | Powder, Granule | 80-90℃ | 45-75 g/10min |
Recommended Bonding Conditions
| Temperature | Pressure | Time |
|---|---|---|
| 100-110 ℃ | 2.0 kgf / m² | 10-15 seconds |
Key Features & Benefits
- Low melting and activation temperature
- Strong adhesion to genuine leather and synthetic leather
- Excellent bonding to textile linings and foam
- Soft and flexible bond line suitable for footwear
- Good resistance to oil, moisture, and sweat
- Solvent-free and environmentally friendly
Industrial Applications
Electronics
Secure bonding for components and protective coatings with non-conductive properties meeting electrical safety standards.
Footwear & Leather
Flexible, waterproof adhesion for shoe soles, uppers, and leather laminates that withstands repeated bending and moisture exposure.
Automotive
Used in filters, interior trims, and under-the-hood components with resistance to oils, vibrations, and temperature fluctuations.
Packaging & Manufacturing
Enhances durability in heat-shrink tubing, composite assemblies, and heavy-duty packaging solutions.
Frequently Asked Questions
What is Modified Polyamide (PA) Hot Melt Adhesive?
Modified polyamide hot melt adhesive is a thermoplastic adhesive based on polyamide, chemically modified for improved performance.
What materials is this hot melt adhesive compatible with?
It is suitable for bonding leather, synthetic leather, fabrics, foam, TPU, EVA, and more. Widely used in laminating shoe uppers, linings, insoles, etc.
How should the product be stored?
Store in a cool, dry, and well-ventilated area away from direct sunlight and heat sources. Shelf life is typically 12-24 months in unopened packaging.
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Contact Us at Any Time
+86-15221126228
No. 505 Huiping Rd Nanxiang Jiading District Shanghai 201802 China
