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Polyamide Hot Melt Adhesive
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Yellow Modified Polyamide Glue PA High Temperature Hot Glue Adhesive For Footwear Laminating
Yellow Modified Polyamide Glue PA High Temperature Hot Glue Adhesive For Footwear Laminating
  • Yellow Modified Polyamide Glue PA High Temperature Hot Glue Adhesive For Footwear Laminating
  • Yellow Modified Polyamide Glue PA High Temperature Hot Glue Adhesive For Footwear Laminating
  • Yellow Modified Polyamide Glue PA High Temperature Hot Glue Adhesive For Footwear Laminating

Yellow Modified Polyamide Glue PA High Temperature Hot Glue Adhesive For Footwear Laminating

Product Details:
Place of Origin: China
Brand Name: JCC
Certification: Oeko-tex Certificate, ISO, ZDHC
Model Number: JCC-PA 2080， JCC-PA 2170
Document: Polyamide Products(Modified...A).pdf
Detail Information
Place of Origin:
China
Brand Name:
JCC
Certification:
Oeko-tex Certificate, ISO, ZDHC
Model Number:
JCC-PA 2080， JCC-PA 2170
Document:
Polyamide Products(Modified...A).pdf
Material:
Polyamide
Color:
Light Yellow
Type:
Granule And Powder
Melting Temperature:
80-90 ℃
Peel Strength:
High
Open Time:
10-20 Seconds
Highlight:

High Light

Highlight:

yellow polyamide glue

,

PA polyamide glue

,

Footwear Laminatinghigh temperature hot glue

Trading Information
Minimum Order Quantity:
1000KG
Price:
USD 3.00 - 9.00 /KG
Packaging Details:
bags
Delivery Time:
8-10 days
Payment Terms:
T/T
Supply Ability:
2000 tons/month
Product Description
Modified Polyamide PA Hot Melt Adhesive for Leather Footwear Shoe Laminating
Product Specifications
Material Polyamide
Color Light yellow
Type Granule and powder
Melting Temperature 80-90 ℃
Peel Strength High
Open Time 10-20 seconds
Product Overview

Our Modified Polyamide (PA) Hot Melt Adhesive Series represents a breakthrough in high-performance bonding solutions. Engineered through specialized polycondensation technology, these premium-grade resins deliver exceptional versatility and reliability across demanding industrial applications.

Technical Specifications
Series Type Form Melting Range Melting Flow Index @160℃, 2.16kg
PA Material JCC-2080 Powder, Granule 80-90℃ 45-75 g/10min
Recommended Bonding Conditions
Temperature Pressure Time
100-110 ℃ 2.0 kgf / m² 10-15 seconds
Key Features & Benefits
  • Superior Environmental Resistance: Maintains integrity in extreme temperatures and offers excellent resistance to oils and chemicals for long-term durability.
  • User-Friendly Properties: Odorless composition with exceptional flexibility and rapid curing speeds for optimized production efficiency.
  • Universal Adhesion: Forms robust bonds with metals (aluminum, steel), plastics, rubber, textiles, and composites for multi-material applications.
Industrial Applications
  • Electronics: Secure bonding for components and protective coatings with non-conductive properties meeting electrical safety standards.
  • Footwear & Leather: Flexible, waterproof adhesion for shoe soles, uppers, and leather laminates that withstands repeated bending and moisture exposure.
  • Automotive: Used in filters, interior trims, and under-the-hood components with resistance to oils, vibrations, and temperature fluctuations.
  • Packaging & Manufacturing: Enhances durability in heat-shrink tubing, composite assemblies, and heavy-duty packaging solutions.
Frequently Asked Questions
What is Modified Polyamide (PA) Hot Melt Adhesive?
Modified polyamide hot melt adhesive is a thermoplastic adhesive based on polyamide, chemically modified for improved performance.
What materials is this hot melt adhesive compatible with?
It is suitable for bonding leather, synthetic leather, fabrics, foam, TPU, EVA, and more. Widely used in laminating shoe uppers, linings, insoles, etc.
Is it environmentally friendly? Does it contain toxic substances?
Modified polyamide hot melt adhesives are solvent-free and environmentally friendly. They usually do not contain VOCs (volatile organic compounds), formaldehyde, or other harmful substances. Compliant with REACH and RoHS regulations.

Tags:

hot melt adhesive,

PA adhesive,

modified polyamide adhesive

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