Melting 70C - 110C PA Powder Co Polyamide Hot Melt Adhesive

JCC low temperature lamination PA powder is a high-performance copolyamide-based hot melt adhesive designed specifically for low-temperature lamination applications. This product is supplied in powder form, enabling even distribution and precise application across various substrates.

Formulated with copolyamide polymers, it offers excellent adhesion, flexibility, and chemical resistance, while allowing for lamination at reduced processing temperatures—typically between 110°C and 120°C. This makes it particularly suitable for temperature-sensitive fabrics and materials, helping to prevent color fading, distortion, or degradation caused by high heat.

• Low melting point for use in delicate textile lamination
• Strong bonding strength to a wide range of synthetic and natural fabrics
• Soft hand feel and good wash durability
• Environmentally friendly, solvent-free formulation

• Clothing lamination (outerwear, sportswear, underwear)
• Garment interlinings and reinforcement
• Leather and synthetic leather bonding
• Technical textiles (e.g., automotive, medical fabrics)

• Low processing temperature - protects fabrics
• Excellent Bonding Performance
• Soft and Flexible
• Solvent-free and eco-friendly

Low-temperature PA hot melt adhesive is a copolyamide-based adhesive with a relatively low melting point. It is widely used for bonding and laminating heat-sensitive materials, especially in the textile and flexible materials industries.

Key differences include:

• Lower melting point, making it suitable for materials that can't withstand high heat
• Lower processing temperature, which saves energy and protects substrates
• Softer hand feel, ideal for products requiring comfort and flexibility (e.g., seamless garments)