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| Place of Origin: | Nantong, Jiangsu |
| Brand Name: | JCC |
| Certification: | Oeko-tex Certificate, ISO, ZDHC |
| Model Number: | JCC-PA 6091 |
| Document: | PA hot melt powder.pdf |
JCC low temperature lamination PA powder is a high-performance copolyamide-based hot melt adhesive designed specifically for low-temperature lamination applications. This product is supplied in powder form, enabling even distribution and precise application across various substrates.
Formulated with copolyamide polymers, it offers excellent adhesion, flexibility, and chemical resistance, while allowing for lamination at reduced processing temperatures—typically between 110°C and 120°C. This makes it particularly suitable for temperature-sensitive fabrics and materials, helping to prevent color fading, distortion, or degradation caused by high heat.
| Attribute | Value |
|---|---|
| Composition | Copolyamide |
| Application | Clothes Laminating bonding |
| Type | Hot Melt Adhesive |
| Application Temperature | 110-120℃ |
| Feature | Low temperature lamination |
| Format | Powder |
| Melting Range | 70-110℃ |
| Type | Melting Range (℃) | MFR (g/10min, 160°C) | Pressing Temp (°C) | Dry Cleaning |
|---|---|---|---|---|
| JCC-PA6091 | 70-110 | 27-33 | 110-120 | Yes |
Low-temperature PA hot melt adhesive is a copolyamide-based adhesive with a relatively low melting point. It is widely used for bonding and laminating heat-sensitive materials, especially in the textile and flexible materials industries.
Key differences include:
