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High-Bonding PA Hot Melt Adhesive Powder for Leather Shoe Materials Bonding
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High-Bonding PA Hot Melt Adhesive Powder for Leather Shoe Materials Bonding
| Miejsce pochodzenia | Chiny |
| Nazwa handlowa | JCC |
| Orzecznictwo | Oeko-tex Certificate, ISO, ZDHC |
| Numer modelu | JCC-PA 2080 |
| Dokument | Polyamide PA hot melt adhes...er.pdf |
Szczegóły produktu
Tworzywo:
Poliamid
Typ:
Proszek
Aplikacja:
Wkładanie i laminowanie obuwia
Słowa kluczowe:
Klej termotopliwy poliamidowy do wyściółki obuwia
Temperatura topnienia:
80-90 ℃
czas otwarcia:
10-15 sekund
bezpieczeństwo:
Nietoksyczne i przyjazne dla środowiska
Siła przyczepności:
Mocny
Typ produktu:
Klej topliwy
Okres trwałości:
12 miesięcy
Składowanie:
Przechowywać w chłodnym, suchym miejscu
Podkreślić:
PA hot melt adhesive powder for leather
,high-bonding shoe adhesive powder
,hot melt adhesive for shoe materials
Warunki płatności i wysyłki
Minimalne zamówienie
1000 kg
Cena
USD 3.00 - 6.00 /KG
Szczegóły pakowania
mnóstwo
Czas dostawy
8-10 dni
Zasady płatności
T/T
Możliwość Supply
2000 ton/miesiąc
Opis produktu
High-Bonding PA Hot Melt Adhesive Powder JCC-2080 for Leather Shoe Materials Bonding
Product Description
JCC-PA 2080 is a hot melt adhesive material with modified copolyamides as the main body that bonds quickly. With 100% solid content, it's widely used in clothing interlining, leather and shoe material, heat-transfer printing, hot melt yarn, and automotive interiors. It features proper pressing temperature, high peeling strength, excellent adhesion to textiles, polymer materials and some metals, along with outstanding water/dry washing resistance, chemical resistance, and flexibility.
This polyamide hot melt adhesive is supplied in powder or granule form, allowing compatibility with various processing methods such as hot melt coating, powder scattering, film lamination, and thermal pressing. Upon heating, the resin melts rapidly and flows evenly, creating strong and uniform bonds between interlining materials and upper components.
Technical Data
Composition: Modified Polyamide
Melting Range: 55-85 ℃
Washing Resistance: 40 ℃
Melting Range: 55-85 ℃
Washing Resistance: 40 ℃
Key Features & Advantages
- Strong adhesion to a wide range of footwear materials, including natural leather, synthetic leather, nonwovens, textiles, EVA, and PU substrates
- Excellent flexibility and soft hand feel, maintaining comfort in finished shoes
- Good heat and cold resistance, suitable for different climates and wearing conditions
- High resistance to fatigue and repeated bending, ideal for daily footwear use
- Fast melting and curing speed, improving production efficiency
- Low odor and solvent-free, environmentally friendly and safe for workers
Typical Applications
- Shoe interlining bonding and reinforcement
- Lamination of leather uppers and lining materials
- Bonding of toe puffs, counters, and reinforcement layers
- Footwear components in casual shoes, sports shoes, leather shoes, and boots
Frequently Asked Questions
Q: What is JCC PA 2080?
A: JCC PA 2080 is a modified polyamide (nylon) material, typically supplied in granular or powder form. It offers excellent abrasion resistance, flexibility, chemical resistance, and bonding properties, making it particularly suitable for shoe lining applications requiring good adhesion and durability.
Q: What forms is the adhesive available in?
A: The adhesive is typically supplied in:
Powder form – for powder scattering, coating, or screen application
Granule form – for hot melt coating, extrusion, or film production
Q:Does the adhesive remain flexible after bonding?
A: Yes. One of the key benefits of polyamide hot melt adhesive is its excellent flexibility. After cooling, the bond remains soft and resistant to cracking, even under repeated bending and walking stress.
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