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Notizie aziendali su JCC Invites Global Partners to HIGHTEX 2026 in Istanbul Turkey
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JCC Invites Global Partners to HIGHTEX 2026 in Istanbul Turkey

2026-05-22

Ultime notizie aziendali su JCC Invites Global Partners to HIGHTEX 2026 in Istanbul Turkey
Tianyang New Materials (JCC) Invites Global Partners to Explore Innovative Adhesive Solutions at HIGHTEX 2026
 
Shanghai, May 22nd 2026 — Tianyang New Materials (Shanghai) Technology Co., Ltd. (JCC) is set to participate in HIGHTEX 2026, the International Technical Textiles and Nonwovens Exhibition, held in Istanbul, Turkey, from June 9 to 13, 2026. The company will showcase its full range of high-performance hot-melt adhesive solutions at Booth 121I, Hall 1, Tüyap Fair Convention and Congress Center.
As a leading supplier of adhesive materials in China, JCC specializes in HMA/PSA hot-melt adhesives. Our products are widely used in garments, home textile, printing, automotive interior, footwear hygiene products and so on. With a focus on strong bonding, eco-friendliness, and consistent quality, the company delivers customized solutions to meet diverse industry needs.
At HIGHTEX 2026, JCC will demonstrate its latest product innovations and application cases, offering on-site one-on-one technical consultations and sample testing services. The event serves as a key platform for JCC to connect with global partners and drive technological advancement in the technical textiles sector.
“We are eager to engage with industry peers and customers at HIGHTEX 2026 to explore collaborative opportunities and create shared value,” said the company’s foreign trade director. “We warmly invite all new and existing partners to visit our booth.”
Event Details:
  • Exhibition: HIGHTEX 2026 International Technical Textiles and Nonwovens Exhibition
  • Dates: June 9-13, 2026
  • Venue: Tüyap Fair Convention and Congress Center, Istanbul, Turkey
  • Booth: 121I, Hall 1
  • Website: www.adhesiveshotmelt.com

 

We sincerely look forward to your visit!

 

JCC Tianyang New Materials (Shanghai) Technology Co., Ltd.

2026.5.22

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