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| Τόπος καταγωγής: | ΚΙΝΑ |
| Μάρκα: | JCC |
| Πιστοποίηση: | Oeko-tex Certificate, ISO, ZDHC |
| Αριθμό μοντέλου: | JCC-PA 6150, JCC-PA 6200, JCC-PA 6300 |
| Έγγραφο: | PA hot melt powder.pdf |
Copolyamide (Co-PA) is a specialized class of thermoplastic hot melt adhesives derived from polyamide chemistry. It is available in both powder and granule forms, offering flexibility for different application processes. Designed to melt and flow at relatively low activation temperatures, Co-PA adhesives enable efficient bonding without damaging heat-sensitive fabrics or materials.
| Step | Parameter |
|---|---|
| Powder spreading | Apply evenly over the fabric or printed area |
| Pre-heating (if needed) | 100°C - 120°C |
| Lamination temperature | 120°C - 140°C (depends on fabric & bonding time) |
| Pressing time | 10 - 20 seconds |
| Pressure | 1.0 - 3.0 MPa (medium pressure) |
| Cooling | Let cool under pressure to lock the bond |
